on minimum footprint full size board with metalized back and with small clip heatsink (still air)
February 26, 2013
ID, Drain-to-Source Current (A)
100 10
TOP BOTTOM
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PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .
The IRF6645PbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an Micro8 and only 0.7 mm profile. The DirectFET pack.
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